Board to board connectors offer several distinctive features:

High-Density Interconnect: Allows for a greater number of connections within a compact space, ideal for modern electronic devices where space is at a premium.

Precision Alignment: Engineered with precise alignment capabilities to ensure reliable connectivity even under mechanical stress.

Variety of Pitch Options: Available in various pitches including ultra-fine 0.4mm pitches, catering to different design requirements.

Durability: Constructed from high-quality materials that withstand temperature variations and mechanical vibrations typical in automotive environments.